Home> Industry Information> Epoxy resin, modified epoxy resin adhesive formula (1)

Epoxy resin, modified epoxy resin adhesive formula (1)

November 01, 2022

Epoxy Glue

formula

Component dosage /g component dosage /g
A, 600 Thinner 100 Quartz Powder 40
E-20 Epoxy resin 40 B, boron trifluoride ether solution 142
621 polyhydroxy polyether 10 tetrahydrofuran 72
Lead powder 8 Phosphoric acid 294


Preparation and nationalization First, prepare two components, A and B, and mix them evenly. Curing to -15 ~ 2 °C 24h, can also increase the national temperature.

Use The glue is used to bond metals, hard plastics, glass, ceramics, and wood.

HYJ-26 epoxy adhesive

formula

Component dosage /g component dosage /g
E-51 epoxy resin 100 quartz powder 100
Dibutyl phthalate 15 Dicyandiamide 8
200# Polyamide 10


Preparation and solidification The slurry parts were weighed in order and mixed well. Curing was carried out for 1 h at 80°C, 0.5 h at 100°C, and 2 h at 150°C.

Use The glue is mainly used for metal, glass steel, ceramic bonding and high temperature sealing.

Steel glue

formula

Component dosage /g component dosage /g
A, 6101 Epoxy 100 White Carbon Black 5
J-04 glue 10 ~ 25 aluminum powder 10
O-phthalate dibutyl ester 5 B, J-31G 20 to 35
Quartz powder (300 mesh) 40 KH-550 4


Preparation According to formula dosage, 6101 epoxy resin, dibutyl phthalate, and J-04 rubber were heated to 60° C., mixed and stirred for 10 minutes, and the solid material of component A was added and mixed to be the A component. J-31G, KH-550 were mixed as the B component. The components A and B are mixed to obtain the adhesive. 3h at 25°C or 0.5h at 60°C

Use The glue is used for the bonding of metal, stone, glass, ceramics, cement, etc. Mainly for emergency repair of machine tools, various pipeline plugging and Other Adhesive. The glue is resistant to acid and alkali, and it is resistant to aging for 10 years. The use temperature is -40 ~ 150 °C.

Corrosion-resistant insulating adhesive

formula

Component dosage /g component dosage /g
A, epoxy resin 1 glass fiber 0.02 ~ 0.03
Boron mud 2~3 B, curing agent hexamethylenediamine slag amount


Preparation and curing According to the above components, curing at room temperature.

Purpose The adhesive is used for the bonding of metals, ceramics, wood, concrete, electrical components and as a raw material for insulating materials.

HN-301 adhesive

formula

Component dosage /g component dosage /g
E-51 epoxy resin 100 alumina powder 100
Dibutyl phthalate 20 Ethylenediamine 10


Preparation and curing According to the amount of formula, it is weighed in turn, and the mixture is evenly mixed. The alumina powder is deducted and mixed evenly. Curing at a pressure of 0.07 to 0.1 MPa at room temperature for 48 hours and curing at 80 to 90°C for 2 hours.

Uses The glue is used to glue steel, rubber, metal and non-metal.

HY-3 Adhesive

formula

Component dosage /g component dosage /g
E-44 epoxy 100 hexamethylenetetramine 5
Dibutyl phthalate 16 Acetone 0-5
Ethylenediamine 12


Preparation and curing According to the amount of weighing in order, mixing and mixing evenly, at 00.5 ~ 0.3MPa pressure, curing at room temperature for 24h, then 60 ~ 70 °C curing 6 ~ 8h.

Uses The glue has good water resistance, oil resistance and alcohol resistance. In the range of -60~60°C, it can be used for bonding of structures with little bearing capacity between metal and non-metal, metal and non-metal, and can also be used for joint fixing.

KH-509 Epoxy Adhesive

formula

Component dosage /g component dosage /g
E-44 Epoxy Resin 100 Titanium Dioxide (200 mesh) 50
647# Anhydride 80 Off-duty powder (200 mesh) 50


Preparation and curing According to the proportion of mixed mash, heated to 50 ~ 60 °C, stir evenly. Curing for 3 h at 150 °C. 200 °C 2h.

Use The glue is used for bonding of high temperature resistant structures and bonding of ablative materials. The main bonding stainless steel, aluminum alloy. Bonding ceramics, glass, wood, thermosetting plastics, etc. Used at -40 ~ 250 °C, the adhesive layer is resistant to ablation, creep resistance, but poor toughness.


W-53-NH-520 Epoxy Adhesive

formula

Component dosage /g
A, E-51 epoxy resin 240
Diphenylamine 7.5
Asbestos pickled (100 °C bake 2h) 40
B. Boron trifluoride-tetrahydrofurfuryl fumarate complex 47
Asbestos pickled (100 °C bake 2h) 20
A:B=1.44:0.33


Preparation and curing The components A and B were weighed in order and mixed well. Then, the two components A and B were mixed and used evenly. Curing at 15 ~ 25 °C 0.5h curing.

Use The glue is used at -60 ~ 100 °C, used for metal, some non-metallic bonding.

XY-3 Epoxy Adhesive

formula

Component dosage /g component dosage /g
E-44 epoxy resin 100 hexamethylenetetramine 5
Dibutyl phthalate 15 Acetone 0-5
Hexamethylenediamine 12


Preparation and curing Weigh in order and mix well. Outdoor armpit 24h, +60 ~ 70 °C 6 ~ 8h curing.

Use The glue has good resistance to media and adhesion. For bonding metal and non-metal materials. Used at -60 to 60°C.

The above is the Epoxy resin, modified epoxy resin adhesive formula (1) we have listed for you. You can submit the following form to obtain more industry information we provide for you.

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